This paper study and analysis microelectronic solid film construction and factor that effect the film resistor conductivity and constantity.
本文对微电子固体薄膜结构,以及影响薄膜电阻导电性和稳定性的因素进行了研究和分析。
Designed as a box inside a box, the solid inner wall reduces thermal conductivity while the exterior layer provides additional energy efficiencies.
建筑被设计为一个盒子内嵌一个盒子的形式,内部的实心墙降低了导热系数,而外层提供了额外的节能效果。
The thermal conductivity of thin solid films is different form their bulk material's.
薄膜材料的热导率一般与其相应的块体材料有较大的差异。
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